electronica 2026
10 November 2026 – 13 November 2026
Messe München, Munich, Germany
292 sessions · 298 speakers
Organiser (1)
Media Partner (1)
Association Partners (4)
COGD e.V. - Component Obsolescence Group Deutschland · Electronics Representatives Association · ZVEI e. V., Verband der Elektro- und Digitalindustrie · AMA Association for Sensors and Measurement
Exhibitors (25)
Investment and Development Agency of Latvia · Würth Elektronik · Synaptics · MobiWire Group · Linxens · NXP · Sri Lanka Export Development Board · BMW · VTT · Shanghai Fudan Microelectronics Group Co., Ltd. · Czechtrade · Polish Agency for Enterprise Development · Projektron GmbH · Analog Devices · Business France · TTI, Inc. · TDK Corporation · SPIRIT Slovenia Business Development Agency · Eaton · Z2Data · Applied Materials · Nordic Semiconductor · Invest Lithuania · Arcadis · Conrad Electronic SE
Supporting Partners (10)
EETech · SparkWire · matthias holsten e² consulting GmbH · COSIMA · Markt & Technik · What's new in electronics · Embedded Computing Design · Elektronik Praxis · IFAT Munich · JPW Asia
Agenda
- AI in Automotive 9 November 2026 · ICM Saal 5
- Opening 9 November 2026 · ICM Saal 5
- TBA 9 November 2026 · ICM Saal 5
- Transformation of Software Development with AI 9 November 2026 · ICM Saal 5
- Humanoid Robots – One size fits all? 9 November 2026 · ICM Saal 5
- Humanoids at work: what it takes to put cognitive robots into automotive production 9 November 2026 · ICM Saal 5
- How to build the Agentic AI platform for R&D that ensures impact and cost control 9 November 2026 · ICM Saal 5
- How do we go faster, without sacrificing quality and cost? 9 November 2026 · ICM Saal 5
- Winning in a fragmenting automotive world - Turning geopolitical complexity into competitiveness through multi-site manufacturing, multi-sourcing, and regional go-to-market strategies. 9 November 2026 · ICM Saal 5
- Kraft statt Krise (Brief presentation, followed by a moderated interview and audience Q&A)) 9 November 2026 · ICM Saal 5
- XiM27 Concept car - defining next level smart cabin & interior lighting experience 9 November 2026 · ICM Saal 4
- Three decades of SiC Innovation leading to 200mm production and full vertical integration 9 November 2026 · ICM Saal 2
- Risks and Opportunities in the Electronics Components Supply Chain 9 November 2026 · ICM Saal 5
- Resilience in the Supply Chain 9 November 2026 · ICM Saal 5
- Challenges and Trends in Electronics and Lightning R&D 9 November 2026 · ICM Saal 4
- Electrification 9 November 2026 · ICM Saal 2
- Static and Dynamic Headlight Leveling based on MEMS Accelerometer and Software Algorithm 9 November 2026 · ICM Saal 4
- Flexible and Printed Electronics for Automotive - Applications, Technologies, Opportunities 9 November 2026 · ICM Saal 2
- Wheels, Legs and Chips: Mapping the Physical AI Semiconductor Opportunity 9 November 2026 · ICM Saal 5
- When Surfaces Come Alive: Next-Level Automotive Interior Lighting 9 November 2026 · ICM Saal 4
- Closed Loop Control Development with Functional Twins - AUMOVIO demonstrates how closed loop control applications can be developed and tested using a Functional Twin for real-time ECUs running in a virtual environment. 9 November 2026 · ICM Saal 5
- More than just a connection: Smart FPCs simplify, secure and optimise battery module wiring. 9 November 2026 · ICM Saal 2
- Powering the Electric Era with Secure Data, Trusted Devices, and Intelligent Protection 9 November 2026 · ICM Saal 4
- Efficiency at the Edge: AI as the Engine of Sustainable Electrification 9 November 2026 · ICM Saal 2
- High-Performance Graphic Display Controller-Architectures for Next-Generation Cockpits 9 November 2026 · ICM Saal 5
- CTO Session 9 November 2026 · ICM Saal 5
- Audi.Digital.Light - Technology trends in premium exterior and interior lighting 9 November 2026 · ICM Saal 5
- How interiors create differentiation 9 November 2026 · ICM Saal 5
- From Technology-Defined to Scenario-Defined: Rethinking Automotive User Experience with AI - Insights from China’s Rapid AI Deployment in Mobility 9 November 2026 · ICM Saal 5
- New Mobility Concepts through Automated Transportation - The HOLON urban 9 November 2026 · ICM Saal 5
- When AI Enters the Physical World: The Rise of Physical and Agentic AI - Lessons from aerospace on scaling intelligent products, machines and operations 9 November 2026 · ICM Saal 5
- CTO Roundtable: Is AI in Automotive Industry just a Hype? What are the opportunities, where do you see risks? 9 November 2026 · ICM Saal 5
- electronica Executive Event with CEO Roundtable 9 November 2026
- Startup Pitch: Synthara – Breaking the Memory Wall 10 November 2026 · Hall B4, B4.251
- Cyber Security Forum Welcome & Opening Remarks 10 November 2026 · Hall C6, C6.501
- CRA in Practice: What Manufacturers Need to Do Today to Succeed Tomorrow 10 November 2026 · Hall C6, C6.501
- electronica Opening Dialog 10 November 2026 · electronica Forum, A5.260
- Keynote: From Makers to Millions: Scaling Innovation for the AI Era 10 November 2026 · Hall C5, C5.100
- How the Cyber Resilience Act (CRA) influences MCU / SoC / FPGA selection 10 November 2026 · Hall C6, C6.501
- (E10-1) From Embedded Intelligence to Physical AI: Why Systems Architecture Will Define Next Generation Smart Machines 10 November 2026 · Hall C6, C6.241
- Startup Pitch: HCP Sense – Smart Bearing Monitoring 10 November 2026 · Hall B4, B4.251
- Right-Sizing the MCU for Automotive DC/DC Control: Balancing Cost, Performance, and Platform Evolution 10 November 2026 · Hall B4, B4.445
- Future-Proofing the Automotive Supply Chain under the EU Cyber Resilience Act 10 November 2026 · Hall C6, C6.501
- Cyber Resilience Starts in Silicon: Securing AI-Enabled IoT Systems Through Hardware Roots of Trust 10 November 2026 · Hall C6, C6.501
- Voice to Action: Building Portable Edge AI Applications with Linux and Containers 10 November 2026 · Hall C5, C5.100
- Beyond Isolation: Enabling the Next Generation of 800V Electric Vehicle Architectures 10 November 2026 · Hall B4, B4.445
- (E10-2) Panel Discussion: Building the Embedded Platforms for Tomorrow's Mobility - From Silicon to Software-Defined Vehicles 10 November 2026 · Hall C6, C6.241
- Cyber Security Forum Part 1 Closing Remarks & Break 10 November 2026 · Hall C6, C6.501
- Cyber Security Forum Part 2 Opening Remarks 10 November 2026 · Hall C6, C6.501
- The true enabler for single stage Onboard Charger: Introducing the innovative and unique Automotive CoolGaN™ Bi-directional Switch 10 November 2026 · Hall B4, B4.445
- Beyond Conventional Solder Mask: Unlocking New Potential in PCB Design Through Additive Technology 10 November 2026 · Hall A1, A1.363
- CRA: The New Rules of Engineering Connected Product 10 November 2026 · Hall C6, C6.501
- Geopolitical Challenges, Supply Chain Risks, and Proactive Obsolescence Management 10 November 2026 · Hall A5, A5.260
- (E10-3) From Hazard to Assurance: Functional Safety Across Domains 10 November 2026 · Hall C6, C6.241
- Cutting costs with SMT & THR – A TCO perspective 10 November 2026 · Hall A1, A1.363
- Li Auto's Holistic Optimization of E Drive Efficiency: From Vehicle Architecture to Chip Design 10 November 2026 · Hall B4, B4.445
- What If Edge Servers Were Composable? CXL, COM-HPC and CAPE 10 November 2026 · Hall C5, C5.100
- (E10-4) Physical AI at the Point of Action: Actuation, Sensing and Connectivity for Intelligent Robotics 10 November 2026 · Hall C6, C6.241
- Integrating Supply Chain Transparency into Obsolescence Management 10 November 2026 · Hall A5, A5.260
- Startup Pitch: Luchrome – Ultra-Low-Power Printed Displays 10 November 2026 · Hall B4, B4.251
- PCB Power Integrity and Thickness Challenges in Next-Generation AI Hardware 10 November 2026 · Hall A1, A1.363
- Accelerate Embedded Development with the FRDM Automotive Platform: Exploring Real-Time Control, Sensing, and Visualization 10 November 2026 · Hall C5, C5.100
- (E10-5) From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception 10 November 2026 · Hall C6, C6.241
- Incorporating Obsolescence Management from the Start—Beginning with the Product Development Process 10 November 2026 · Hall A5, A5.260
- From Concept to Deployment: Speeding Up AI & Ruggedised Computing 10 November 2026 · Hall A1, A1.363
- Obsolescence and the Supply Chain 10 November 2026 · Hall A5, A5.260
- (E10-6) Application of novel soft magnetic composites (SMCs) in high-power magnetic devices 10 November 2026 · Hall C6, C6.241
- ST for Startups Program 10 November 2026 · Hall B4, B4.251
- Introduction to Flexible and Printed Electronics 10 November 2026 · Hall A1, A1.363
- (E10-7) The Next Engineering Paradigm: Enabling the Future of Physical AI Through Platform Contextual Intelligence 10 November 2026 · Hall C6, C6.241
- Counterfeit Electronic Components in the Supply Chain: Risks and Advanced Detection Methods 10 November 2026 · Hall A5, A5.260
- Next-generation roll-to-roll printed and hybrid electronics technologies towards smarter, flexible, lighter weight, and sustainable functional solutions 10 November 2026 · Hall A1, A1.363
- Build Professional UIs with LVGL on Riverdi's STM32U5 Board 10 November 2026 · Hall C5, C5.100
- Software-Based E/E Architectures: Enabling SDV Architecture 10 November 2026 · Hall B4, B4.445
- Startup Pitch: MyBotShop – Humanoid Robots in Action 10 November 2026 · Hall B4, B4.251
- When should you NOT use printed electronics? 10 November 2026 · Hall A1, A1.363
- (E10-8) Putting Platform Contextual Intelligence into Practice for Physical AI 10 November 2026 · Hall C6, C6.241
- The Holistic Life Cycle Check-Up as an Entry Point into Obsolescence Management – A Practical Case Study 10 November 2026 · Hall A5, A5.260
- Qualcomm Dragonwing: Modernizing Industrial Automation for the AI Era 10 November 2026 · Hall C6, C6.501
- Zone Controllers at the heart of SDV 10 November 2026 · Hall B4, B4.445