Fintech Proof-of-Concept Subsidy Scheme Showcase: FinTech Innovations for Cross-Border Banking and Insurance Services in the Greater Bay Area
Hong Kong FinTech Week 2021 · 3 November 2021 · 12:05–12:50
Fintech Proof-of-Concept Subsidy Scheme Showcase: FinTech Innovations for Cross-Border Banking and Insurance Services in the Greater Bay Area was a session at Hong Kong FinTech Week 2021 on 3 November 2021 in Hong Kong, with 2 speakers on record.
Speakers
- William Yeung — Panelist Co-founder & CEO, MediConCen
- Christopher Hui — Moderator