SEMICON Europa 2026
10 November 2026 – 13 November 2026
Messe München, Munich, Germany
SEMICON Europa 2026, organised by SEMI Europe and co-located with electronica at Messe München, runs under the theme "Europe's Next Era: Navigating the Perfect Storm". The programme examines the relationship between technological innovation and the shifting geopolitical landscape, and how Europe can build a unified, competitive and sustainable semiconductor ecosystem, covering technological sovereignty, innovation and long-term economic stability through keynotes, conferences, an exhibition and networking.
267 sessions · 246 speakers
Media Partners (45)
Tech Design Forum · Electronic Specifier · Mikroproduktion · ATZ · ReinRaumTechnik · CIOReview · LabWorld · AZoM · Argus · ESSERC · Galvanotechnik · medizin & technik · Power Gen Advancement · SemIsrael · OPE journal · Automotive Logistics & Supply Chain Digital Strategies Europe · Physics World · IndustryChemistry · Compound Semiconductor Magazine · Temcom · Plant Automation Technology · Jautomatise · Journal of Low Power Electronics and Applications · Elektroniktidningen · MDI - Medical Devices Israel · VDI nachrichten · Le Monde de l'Industrie · eeNews Europe · CLEANROOM FUTURE · CIOInsights · The Journal of mHealth · Physics Today · Power Electronics World · ELETTRONICA OGGI · findcourses · Printed Circuit Design & FAB · ACTUTEM · Electronique Mag · Glocal Plus · EPP EUROPE Electronics Production and Test · PhotonicsViews · MedFIT · Electronique Composants & Instrumentation · eMobilServer · Hardware Pioneers
Sponsors (27)
DSV · CEA-Leti · Seeq · Watlow · Flexciton · GERMANY TRADE AND INVEST · Arizona Commerce Authority · Tenstorrent · Siemens · EBARA · A*STAR IME · Planimize · Siegert Wafer · MANN+HUMMEL · Edwards Vacuum · TRUMPF · Semilab · Exyte · INFICON · Infineon · Invest in Pomerania · Youibot · Schneider Electric · D-SIMLAB · Omnitron Sensors · Atotech · European Chips Skills Academy (ECSA)
Association Partners (18)
Bayern Innovativ · EPIC - European Photonics Industry Consortium · 3-D MID e.V. · Automation Network Dresden · Smart Systems Hub Dresden · CAP'TRONIC · Medical Valley EMN · ARIA Regional Association of the Automobile Industry · Silicon Europe · NextMove · MoWiN.net · NanoMicroMaterialsPhotonics.NRW (NMWP.NRW) · AESIN · OES - Organic Electronics Saxony · Cluster Nanotechnologie · Automotive-Cluster Rhein Main Neckar · Silicon Saxony · ACSIEL Electronic Alliance
Exhibitors (12)
Comet AG · Carl Zeiss Microscopy Deutschland GmbH · Intertek · Kistler Instrumente AG · ICEX · Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) · Nova · Semilab · Syenta · N&TS GROUP · Invest in Pomerania · Arcadis
Agenda
- Welcome remarks for the day 10 November 2026 · TechARENA, Hall B0
- Welcome Remarks 10 November 2026 · Executive Forum, Hall C1
- Opening remarks by session chair 10 November 2026 · TechARENA, Hall B0
- Opening keynote presentation, Marijn Vervoorn, Director Sustainability Strategy, ASML 10 November 2026 · TechARENA, Hall B0
- Opening Remarks 10 November 2026 · Executive Forum, Hall C1
- Coming Soon 10 November 2026 · TechARENA, Hall B0
- Chips Act 2.0: How can Europe turn semiconductor excellence into investment, scale and resilience? 10 November 2026 · Executive Forum, Hall C1
- Orchestrating a scalable AI revolution 10 November 2026 · Executive Forum, Hall C1
- PFAS Whitepaper 10 November 2026 · TechARENA, Hall B0
- Navigating the Perfect Storm: Why the Future of AI Depends on Manufacturing Innovation 10 November 2026 · Executive Forum, Hall C1
- Sustainable Microelectronics and the GENESIS project 10 November 2026 · TechARENA, Hall B0
- Innovative Primary Substitution and Secondary Valorisation Routes for Europe's Silicon and Silicon Carbide Semiconductor Raw Material Value Chains 10 November 2026 · TechARENA, Hall B0
- Connecting Technology and Society: SCREEN’s Vision for the Next Generation of Semiconductors 10 November 2026 · Executive Forum, Hall C1
- Circularity Panel Discussion 10 November 2026 · TechARENA, Hall B0
- Singapore's Semiconductor Ecosystem: Accelerating Innovation Through Strategic Partnerships 10 November 2026 · Executive Forum, Hall C1
- Powering the AI Era in Europe: From Semiconductor Innovation to Global Industrial Impact 10 November 2026 · Executive Forum, Hall C1
- Coming Soon 10 November 2026 · TechARENA, Hall B0
- Beyond Performance: How the Semiconductor Industry and Ericsson Can Accelerate Decarbonization 10 November 2026 · Executive Forum, Hall C1
- To be announced 10 November 2026 · TechARENA, Hall B0
- Powering Europe’s Semiconductor Future: Energy Intelligence for Resilient, Sustainable Growth 10 November 2026 · Executive Forum, Hall C1
- Semiconductor-X: Demonstrate a Novel Data Ecosystem for the Semiconductor Supply Chain Accelerating TTM and Improving Resilience 10 November 2026 · TechARENA, Hall B0
- Quantum-Safe Silicon: From Chips to Cyber-Resilient Systems 10 November 2026 · TechARENA, Hall B0
- Semiconductor & Electronics Opportunities in India 10 November 2026 · Executive Forum, Hall C1
- Coming Soon 10 November 2026 · NextSEMI Arena
- The Future of Europe's Industrial Policy 10 November 2026 · Executive Forum, Hall C1
- Sovereign AI at the Edge: Heterogeneous, Decentralised and Collaborative Compute 10 November 2026 · TechARENA, Hall B0
- Closing Remarks and SEMI Academia Impact Award, Laith Altimime, President, SEMI Europe 10 November 2026 · Executive Forum, Hall C1
- Beyond Glass: A New Reinforcement Architecture for High-Frequency Electronics 10 November 2026 · NextSEMI Arena
- The myth of troubleshooting 10 November 2026 · NextSEMI Arena
- Magnetocalorics: Next-Generation Cooling for Semiconductors 10 November 2026 · NextSEMI Arena
- Welcome Remarks 10 November 2026 · Executive Forum, Hall C1
- Opening remarks by session chair 10 November 2026 · TechARENA, Hall B0
- From Plasma-System Design to Deployment: An Integrated Engineering and Global Supply-Chain ApproachSubtitle: From Process Requirements to Upgradeable Process Platforms 10 November 2026 · NextSEMI Arena
- Orchestrating a scalable AI revolution 10 November 2026 · Executive Forum, Hall C1
- Chips Act 2.0 and International Collaboration, Arian Zwegers, Deputy Head of Unit, DG CONNECT (Unit C.3) 10 November 2026 · TechARENA, Hall B0
- The Pervasive Intelligence With AI That Learns Inside the Sensor 10 November 2026 · NextSEMI Arena
- ICOS²: Driving International Cooperation on Semiconductors 10 November 2026 · TechARENA, Hall B0
- What does an AI Workload actually need from silicon? imec's cross stack view 10 November 2026 · Executive Forum, Hall C1
- Panel Discussion: Connecting Europe’s Capabilities with Trusted Partners 10 November 2026 · TechARENA, Hall B0
- How to build & scale the European AI ecosystem? 10 November 2026 · Executive Forum, Hall C1
- Presentation by Ericsson 10 November 2026 · Executive Forum, Hall C1
- Beyond Automotive: chiplets as the Foundation for Autonomous Edge Platforms 10 November 2026 · Executive Forum, Hall C1
- Industry Keynote 10 November 2026 · Executive Forum, Hall C1
- Panel discussion: Chips Act 2.0: From Capacity to Competitiveness 10 November 2026 · Executive Forum, Hall C1
- Opening Remarks & The Future Semiconductor Workforce: Skills, Inclusion and Retention 10 November 2026 · TechARENA, Hall B0
- Prompt or Perish? A Panel Discussion on AI, Skills, Hiring & Workplace Ethics 10 November 2026 · TechARENA, Hall B0
- Chips Act 2.0 and SSTS: Building Europe's Next Semiconductor Advantage 10 November 2026 · Executive Forum, Hall C1
- From Vision to Impact: Three Years of NanoIC Enabling Future Semiconductor Technologies 10 November 2026 · Executive Forum, Hall C1
- Design enablement services: lowering the barrier for IC design companies 10 November 2026 · Executive Forum, Hall C1
- Closing Remarks 10 November 2026 · Executive Forum, Hall C1
- Spark Excellence Award to be presented by Cassandra Melvin, Senior Director, Business Development and Operations, SEMI Europe 10 November 2026 · TechARENA, Hall B0
- Welcome Remarks 11 November 2026 · ICM Munich, Room 14a
- Opening Remarks by Session Chair 11 November 2026 · ICM Munich, Room 14a
- Scaling Beyond the Fab: Advanced Packaging, Test, and Supply-Chain Outlook 11 November 2026 · ICM Munich, Room 14a
- Welcome Remarks 11 November 2026 · ICM Munich, Room 14c
- Opening Remarks by Session Chair 11 November 2026 · ICM Munich, Room 14c
- Topic Coming Soon 11 November 2026 · ICM Munich, Room 14c
- Coming Soon 11 November 2026 · ICM Munich, Room 14a
- Coming Soon 11 November 2026 · ICM Munich, Room 14c
- Advanced Packaging: Redefining the New Front End Through Materials Innovation 11 November 2026 · ICM Munich, Room 14a
- Winning in the EU: Margin & Complexity Over Volume 11 November 2026 · ICM Munich, Room 14c
- WalTIS: Wafer-Level Thermal Integration for Advanced Semiconductor Packaging 11 November 2026 · ICM Munich, Room 14a
- Hydrodynamics-Driven wet etching for scalable fabrication of high-aspect-ratio through-glass vias in glass core substrates 11 November 2026 · ICM Munich, Room 14a
- Air Liquide Advanced Materials : European solutions for chip manufacturing technology innovation 11 November 2026 · ICM Munich, Room 14c
- Engineering Bonding Materials for Power Devices Using Stress-Relaxing Sintering Materials and Transient Liquid Phase Diffusion Bonding Sheet 11 November 2026 · ICM Munich, Room 14a
- Application of SnAg and Nano-Porous Cu Structures for Advanced Micro-Bump Pattern and Their Properties 11 November 2026 · ICM Munich, Room 14a
- A Design-Enabled Advanced Packaging Ecosystem for Heterogeneous Integration and Co-Packaged Optics 11 November 2026 · ICM Munich, Room 14a
- SWIR Illumination for Sub-Surface and Backside Inspection in Advanced Packaging Metrology 11 November 2026 · ICM Munich, Room 14a
- Functional Silicon Interposers for 2.5D integration 11 November 2026 · ICM Munich, Room 14a
- Leveraging Advanced Bonding Technologies to Enable Scalable Co-Packaged Optics Architectures 11 November 2026 · ICM Munich, Room 14a
- Application of Underfill and Benzocyclobutene in Advanced Flip Chip Technology for Packaging and Reliability in Terrestrial and Space Environments 11 November 2026 · ICM Munich, Room 14a
- From AI Demand to Fab Reality: Investment, Capacity, and Manufacturing Outlook 11 November 2026 · ICM Munich, Room 14c
- Advanced Packaging for high mix and low volume, Flip Chip capabilities beyond the standard in Europe 11 November 2026 · ICM Munich, Room 14a
- The role of Atomic-Level Purification (ALP) on reliability and yield in advanced packaging 11 November 2026 · ICM Munich, Room 14a
- Closing Remarks by Session Chair, Steffen Kröhnert, President & Founder, ESPAT Consulting 11 November 2026 · ICM Munich, Room 14a
- Opening Remarks by Session Chair 11 November 2026 · Executive Forum, Hall C1
- Opening Remarks by Session Chair, Carina Lainer, Principal, Microelectronics, Quantum, Photonics, Optics and Electronic Chemicals, Roland Berger 11 November 2026
- Welcome Remarks 11 November 2026 · TechARENA, Hall B0
- The Global Semiconductor Market: Crossing the $1 Trillion Milestone in Q3 2026 and the Outlook Ahead 11 November 2026
- Opening Remarks by Session Chair, Philippe Monnoyer 11 November 2026 · TechARENA, Hall B0