How smart silicon chips can help scale protein engineering workflows
SLAS 2027 International Conference & Exhibition · 2 February 2027 · 16:30–16:55 · 7AB
How smart silicon chips can help scale protein engineering workflows was a session at SLAS 2027 International Conference & Exhibition on 2 February 2027 in San Diego, with 1 speaker on record.
Speakers
- Chengxun Liu — Speaker Technology manager, Imec