B2DB — Who said what, where, and when

TRUSTECH 2026

1 December 2026 – 3 December 2026

Paris Expo Porte De Versailles, Paris, France

TRUSTECH is an international event dedicated to payment and identification technologies, held annually at Paris Expo Porte de Versailles. Originally launched as CARTES Secure Connexions and renamed TRUSTECH in 2016, it brings together technology providers, financial institutions, public sector organisations, start-ups and international experts over three days, covering innovative payments, digital identity, biometrics, digital security, cybersecurity and trust technologies through an exhibition, a conference programme, the TRUSTECH Innovation Awards and business meetings. The 2026 edition takes place from 1 to 3 December 2026.

48 sessions · 82 speakers

Organiser (1)

Comexposium

Media Partners (13)

The Paypers · Financial IT · Acuity Market Intelligence · Coinpedia · Mobile Ecosystem Forum · Biometric Update · PayTechLaw · Finyear · PaymentMedia · S&D Magazine · Archimag · Nilson Report · Crypto Reporter

Association Partners (10)

Trusted Connectivity Alliance · Mercatel · Finance Innovation · GlobalPlatform · Women in Identity · Secure Identity Alliance · AFTE · Document Security Alliance · Silicon Trust · FIDO Alliance

Exhibitors (86)

Jura JSP · Wisecard · Shenzhen Kaisere Technology Co. · RINAS GERÄTETECHNIK GmbH · Dongguan Ketian Smart Card Technology Co., Ltd. · LAPIS DRUCKTECHNOLOGIE GMBH · ARCA ETICHETTE SPA · Shenzhen Sunlanrfid Technology Co., Ltd. · IDnow · Jiangsu Huaxin High-Tech New Material Co., Ltd. · ISRA CARDS · MADA MARX DATENTECHNIK GMBH · Feitian Technologies · Pacific Security Technologies(Beijing) · Linxens · Telepower Communication Co Ltd · IDP CORP., LTD. · Wuhan Wenlin Technology Co Ltd · Beijing Yicheng Xintong Technology Co., Ltd · HEJIN GROUP SDN BHD · ELYCTIS · AdvanIDe · STMicroelectronics · Dongguan ZKY Technology Co., Ltd. · LUMINOCHEM Ltd · AUG. SCHWAN GMBH & CO. KG · PARAGON ID · Gradiant · OTTO KUENNECKE GMBH · UbiVelox · BÖWE SYSTEC · IDENTIS SA · Dascom Europe · TrustSEC · ARKSIGNER · JinGuan Tech (ShenZhen) Co. · Evolis · Magicard Ltd · HONGFILMS · Silone Cardtech · BioRugged · STARDUST MATERIALS, LLC · DUALi Inc · BG Ingenierie · MAOSCO Ltd. · X INFOTECH · GET Group Holdings Ltd. · DEMAX HOLOGRAMS PLC · KYTronics Corporation Ltd · CARDMATIX HK · Guanmei · Tegona SA · TIANJIN BOYUAN NEW MATERIALS CO., LTD · Barnes International · Advanced Card Systems Ltd · MaskTech GmbH · Shenzhen Jianhe Smartcard Technology Co., Ltd. · ARH Inc. · cetecom advanced · ruhlamat GmbH · DERMALOG · KEOLABS · KURZ STIFTUNG & CO · Cetis d.d. · BLUECREST · PPI Adhesive Products Ltd · Document Security Alliance · Axode · Ingroupe · OVD KINEGRAM AG · Samsung Semiconductor · GREENCORP PTY LTD · ITW SPECIALTY FILMS · HID Global · Ellipse · Calmell Group part of HID · KLÖCKNER PENTAPLAST OF AMERICA, INC. · Atlantic Zeiser · Fime · COMPRION · Covestro a/s · Huaye Cables Technology Co., LTD · ID4US · Baoding Lucky lnnovative Materials Co., Ltd. · IQ STRUCTURES s.r.o. · Shenzhen Liangbida Technology Co.,LTD

Knowledge Partners (2)

PARTELYA CONSULTING · Edgar, Dunn & Company

Supporting Partner (1)

Nuecir

Agenda