Piers Marais
Global Head of Product, Embedded Cross Border Solutions, pavillion
Piers Marais is listed as Global Head of Product, Embedded Cross Border Solutions, pavillion. B2DB records 2 sessions at 2 conferences between 2022 and 2025, most recently Fintech Connect 2025 (December 2025). Speaks mainly on Digital Assets & Web3 and Payments.
Compiled from published conference agendas; not yet confirmed by Piers. Is this you? Claim this profile.
- Topics: Digital Assets & Web3, Payments
- LinkedIn · FF News profile
Sessions at 2 conferences
Fintech Connect 2025 2 December 2025 – 3 December 2025
- Redefining Value in Cross-Border Payments with Connected Business Data Speaker · 2 December 2025