Advanced Packaging, Assembly and Test Manufacturing for European customers in Europe? - Why it is needed, or why not?

Name: Advanced Packaging, Assembly and Test Manufacturing for European customers in Europe? - Why it is needed, or why not?
Start: 2026-11-11T17:35
End: 2026-11-11T18:15
Location: Messe München

SEMICON Europa 2026 · 11 November 2026 · 17:35–18:15 · ICM Munich, Room 14a

Advanced Packaging, Assembly and Test Manufacturing for European customers in Europe? - Why it is needed, or why not? was a session at SEMICON Europa 2026 on 11 November 2026 in Munich, with 5 speakers on record.

Speakers

Didier Floriot — Panelist Director Strategy Technology, Devices and Materials, Thales Las France SAS
Steffen Kröhnert — Moderator President & Founder, ESPAT-Consulting
Eoin OToole — Panelist Research and Development Director, Amkor Technology Portugal, Amkor Technology, Inc.
Angela Kessler — Panelist Senior Principal Engineer Package Concepts, Infineon
Sander Dorrestein — Panelist Program Manager Integrated Photonics, PITC