Digital Infrastructure World 2027
3 February 2027
San Jose McEnery Convention Center, London, United Kingdom
Digital Infrastructure World (DIW) 2027 is an AI data center conference and exhibition, organized by CloserStill Media in collaboration with the Open Compute Project (OCP) and incorporating OCP Tech Day. It brings together the teams designing the rack and the teams building the data center across silicon, systems, networking, power, cooling and energy, with Rack, Cluster, Data Center and Energy tracks.
95 sessions · 75 speakers
Organiser (1)
Sponsors (4)
Open Compute Project Foundation · Hydra Host · Uptime Institute · Technology Reseller News
Exhibitors (8)
Danfoss · SUPMEA · Digital Realty · Hedgehog · Hydra Host · Phoenix Contact · Akamai · IFM
Strategic Partner (1)
Open Compute Project Foundation
Speakers (75)
- Harry Soin Senior Technical Marketing Director, Advanced Energy
- Daniel Medina Executive Vice President of Strategy, Available Infrastructure
- Abhijit Lahiri Senior Director, Product Management, AI Infrastructure, Keysight Technologies
- Lowell Lamb Distinguished Engineer, Broadcom
- Ram Nagappan VP, AI Infrastructure, Oracle
- Sean James Distinguished Engineer - Energy Systems, NVIDIA
- Usha Kodali Product Lead, DSX Air and Spectrum-X Telemetry, NVIDIA
- Joel Chakkalakal Director, Data Centers & Sustainability, Americase
- Nicolas Bontigui Analyst, SemiAnalysis
- Nilesh Shah VP Business Development, ZeroPoint Technologies
- Abdul Kabbani Partner, Network Silicon Architecture, Microsoft
- Aditya Raina Chief Marketing Officer, GUC
- Aniket Singh Global Product Manager, TE Connectivity
- Antonello Antoniazzi ABB
- Anu Ramamurthy Associate Fellow, Design, Microchip
- Arun Anbumani Principal Member of Technical Staff, Oracle
- Brian Aspnes Senior Principal Hardware Architect, Intel
- Brian Deckard Technical Regulation and Standardization Expert, Siemens
- Cihan Aydin Senior Design Engineer, Power Electronics, Delta Electronics
- Dharmesh Jani Head of Ecosystem and Partnerships, Astera Labs
- Dominic Brown Senior Principal Engineer, Arm
- Dudy Cohen VP, Product Marketing, DriveNets
- Emre Koksal Professor, Electrical and Computer Engineering, Ohio State University
- Gregory D Sellman Principal Member of Technical Staff, AMD
- Hal Loket System Architect, TE Connectivity
- Harshada Jadhao Senior Project Engineer, Mission Critical, DPR Construction
- Jack Backes Principal Strategist, Provident Data Centers
- Jacob Mwanza Category Manager, Contract Services - Power, Crusoe
- Jawad Nasrullah CEO, Palo Alto Electron
- Jayesh Shah Director, Infrastructure Architecture, Microsoft
- Jihoon Yoon Product Manager, FuriosaAI
- Justin Mark Herrmann Product Manager AI Power Solutions, Rittal
- Kiran Thakkar Master Principal Cloud Architect, Oracle
- Kyle Chien Senior Director, Platform Innovation, Digital Realty
- Manoj Wadekar Networking AI Technologist, Meta
- Marc Meunier Director, HW Ecosystem, Arm
- Mark Knight Director of Product Management, Arm
- Michael Posner Senior Product Group Director, Compute Solutions Group, Cadence Design Systems
- MJ Song AI Systems Engineer, Meta
- Nicole Dierksheide Global Category Director, Large Power, Rehlko
- Pratik Marolia Principal System Architect, Microsoft
- Praveen Kumar Velpuri Principal Software Engineer, Microsoft
- Pravin Patel VP and GM, Platform Solutions Group, Astera Labs
- Richard Barry Visiting Scientist, Research Laboratory of Electronics, MIT
- Saif Elsaady Hardware Ecosystem Manager, Arm
- Satadal Bhattacharjee Global Head of Cloud and AI Infrastructure Silicon, Arm
- Satarupa Bal Senior Power Electronics Engineer, Google
- Shripad Chandrachood Principal Application Engineer, MathWorks
- Stewart Nguyen System Architect, Lenovo
- Susmita Panda Google
- Sven Finke Product Director 800VDC Power Rack, Bosch
- Sylvain Guilley Fellow, Cadence
- Thomas Ng Platform Architect, Intel
- Toby Ford Head Design Architect, WhiteFiber
- Tom Moyer Founder and Principal, 7 Elm Strategies
- Vinayak Vashishtha Software Development Manager, AWS Annapurna Labs, AWS
- Wael Noureddine VP, Silicon Architecture, Microsoft
- Yang Hsiung Principal Firmware Engineer, Microsoft
- Yanjun Xia Meta
- Ahmed Munir Charter Communications
- Andrejka Bernatova CEO and Chairman of the Board, Dynamix
- Artem Shitov Knowledge Specialist, McKinsey
- Bill Severn 1623 Farnam Data Centers
- Jake Ring CEO and Co-Founder, Power & Data Management (PDM)
- Jigar Savla Silicon Architect and Product Manager, Tensordyne
- John Lyntton Director, Product Management, Colocation and Services, Equinix
- Moshe Tanach Co-Founder and CEO, NeuReality
- Rishab Vardhan Harikrishnan Principal Hardware Product Manager, Oracle
- Robert Post VP of Engineering, Nautilus Data Technologies
- Scott Willis President and CEO, DartPoints Data Centers
- Shahar Noy VP and General Manager, Data Centers, QuantumScape
- Astrid Atkinson CEO and Co-Founder, Camus Energy
- Cliff Grossner Chief Innovation Officer, Open Compute Project
- Ella Zhou Senior Director, Data Center Technologies, Siemens
- Mahesh Subramaniam Sr. Director of Product Management, AI Data Centers, HPE
Agenda
Showing 80 of 95 sessions.
- Opening Remarks 2 February 2027 · Mainstage
- OCP-DIW Convergence Panel 2 February 2027 · Mainstage
- Welcome Remarks 3 February 2027 · Main Plenary Hall
- OCP Invited Keynotes 3 February 2027 · Main Plenary Hall
- Cluster Introduction 3 February 2027 · Room B
- OCP at Digital Infrastructure World 3 February 2027 · Room A
- Energy Introduction 3 February 2027 · Room D
- Data Center Introduction 3 February 2027 · Room C
- Flexibility the Grid Can Count On: Turning Curtailable Load Into Interconnection Capacity 3 February 2027 · Room D
- OCP Data Center - Track Keynote 3 February 2027 · Room C
- Current Activities in the Open Cluster Designs for AI Strategic Initiative 3 February 2027 · Room B
- Open Ecosystem Can Unlock Velocity for AI DCs 3 February 2027 · Room A
- AI Training Clusters 3 February 2027 · Room B
- Open Racks 3 February 2027 · Room A
- Bring Your Own Power: On-Site Generation at 1GW 3 February 2027 · Room D
- Build-to-Suit AI Campuses 3 February 2027 · Room C
- Enabling 1MW Racks 3 February 2027 · Room C
- Training Reliability and Goodput 3 February 2027 · Room B
- Construction Labor and CapEx Risk 3 February 2027 · Room D
- Open Racks 3 February 2027 · Room A
- Your AI Cluster's Real Bottleneck Is How Fast It Can Change 3 February 2027 · Room B
- From Grid to Chip: System Level Simulation of MVAC and LVDC Infrastructure 3 February 2027 · Room C
- Applying OCP ORv3 and ORW Design Principles to Rack-Scale Arm AI Infrastructure with Supermicro 3 February 2027 · Room A
- Speed to Power for AI Campuses 3 February 2027 · Room D
- Grid Interactivity and Load Volatility 3 February 2027 · Room D
- AI Infrastructure Supply Chains 3 February 2027 · Room B
- Procurement for AI Data Centers 3 February 2027 · Room C
- The Open Chiplet Economy: From Chiplets to AI Systems 3 February 2027 · Room A
- Scaling Up AI Compute, Memory and Connectivity 3 February 2027 · Room A
- Co-Designing the Power Envelope: Breaking Infrastructure Silos for Gigawatt-Scale AI Clusters 3 February 2027 · Room D
- Scale-Out Fabrics for AI Clusters 3 February 2027 · Room B
- When Communities Push Back: Avoiding Escalation in AI Infrastructure 3 February 2027 · Room D
- Building Interoperable AI Systems with Chiplets: Arm Neoverse and Cadence in an Open Ecosystem 3 February 2027 · Room A
- Building AI Data Centers at Speed: Managing Power, Cooling and Construction Risk 3 February 2027 · Room C
- From Hardware to Useful Capacity: Provisioning AI Infrastructure at Scale 3 February 2027 · Room B
- AI Space Data Centers 3 February 2027 · Room D
- Prefab and Modular 3 February 2027 · Room C
- Securing the Open Chiplet Ecosystem: Defining a Common Security Architecture for FCSA 3 February 2027 · Room A
- AI Training Campuses 3 February 2027 · Room C
- AI-Native Servers 3 February 2027 · Room A
- Cleaner AI Infrastructure 3 February 2027 · Room D
- Lightning Talks: Inside the Cluster 3 February 2027 · Room B
- Neocloud AI Data Centers 3 February 2027 · Room C
- Open Adapter Card (OAC): Sub-Rackscale Acceleration Lives On 3 February 2027 · Room A
- Developing 10GW Pipelines 3 February 2027 · Room D
- Building 1GW AI Data Centers 3 February 2027 · Room C
- Architecting 1M GPU Clusters 3 February 2027 · Room B
- OCP NIC 2026: Gen 7 and Liquid Cooling, More Speed and Power Ahead 3 February 2027 · Room A
- From Megawatts to Tokens: Who Operates the AI Factory 3 February 2027 · Room A
- Day 2 Welcome Remarks 4 February 2027 · Main Plenary Hall
- IT and Data Centers, Designed as One 4 February 2027 · Main Plenary Hall
- Panel: The Neocloud Giants of AI 4 February 2027 · Main Plenary Hall
- Panel: 3P Data Centers, At the Speed of AI 4 February 2027 · Main Plenary Hall
- Rack Introduction 4 February 2027 · Room A
- Data Center Introduction 4 February 2027 · Room C
- Cluster Introduction 4 February 2027 · Room B
- Energy Introduction 4 February 2027 · Room D
- OCP Data Center - Track Keynote 4 February 2027 · Room C
- Nuclear and SMRs for Data Centers 4 February 2027 · Room D
- Beyond Physical Digital Twins: Why Logical Digital Twins Are Essential for AI Factory Design, Validation and Operations 4 February 2027 · Room B
- ESUN: Open Ethernet for the AI Scale-Up Era 4 February 2027 · Room A
- MRC: A Purpose-Built RDMA Transport for AI Training Networks 4 February 2027 · Room A
- 800V Power for AI Data Centers 4 February 2027 · Room C
- Node-to-Rack Efficiency for Real-World AI Inference: Arm and FuriosaAI 4 February 2027 · Room B
- In-Rack Scale-Up Interconnect 4 February 2027 · Room A
- Inference in 2027: From Chip to Bill 4 February 2027 · Room B
- Air vs. Liquid: Where Does Air Cooling Still Win for General Compute? 4 February 2027 · Room A
- Building the DC Power Architecture for AI Data Centers: From System Requirements to Validation and Certification 4 February 2027 · Room C
- Putting AI to Work: Shifting from AI Training to AI Inference Data Centers 4 February 2027 · Room D
- Executive Session 4 February 2027 · Innovation Stage
- Neocloud AI Cluster Architectures 4 February 2027 · Room B
- Beyond the Cold Plate: Warm Water, Retrofits, and the Open Road for Liquid Cooling 4 February 2027 · Room A
- Cooling for AI Data Centers 4 February 2027 · Room C
- Securing Power for AI Sites 4 February 2027 · Room D
- Consolidating Liquid Cooling and Power Management onto a Single Rack Management Controller 4 February 2027 · Room A
- HPC Lessons for AI Clusters 4 February 2027 · Room B
- Sustainable AI Data Centers 4 February 2027 · Room C
- Scaling Hyperscale Power Delivery: Managing Aggregated and Cascaded Power Shelf Architectures for High-Density GPU Systems 4 February 2027 · Room A
- Rethinking AI Data Center Power Provisioning with Distributed Energy Storage 4 February 2027 · Room D
- Overcoming AI's Power and Space Constraints with Scale-Across Deployments 4 February 2027 · Room B